发明名称 LEAD FRAME AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To obtain a small-sized lead frame easily from a single layer metal plate which lead fame is provided with a land of multi-row constitution, in particular, a land of at least three rows. SOLUTION: A lead frame 10 is provided with a frame yoke 11 and a plurality of outside inner lead 14B which are arranged between the frame yoke 11 and inside inner leads 14A, stretched to the inside from the frame yoke 11 and provided with protruding parts 14a on the lower surface side of a die pad 13. The inside inner leads 14A are insulated from the die pad 13 by cutting and eliminating retaining parts of the die pad 13 and the inside inner leads 14A. Bottom surfaces of the frame yoke 11 and a plurality of the inside inner leads 14A and the outside inner leads 14B are held by an adhesive tape member 20 as a lead holding member.
申请公布号 JP2002246532(A) 申请公布日期 2002.08.30
申请号 JP20010037484 申请日期 2001.02.14
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 KAWAI FUMIHIKO;NANO MASANORI;KOGA AKIRA;FUKUDA TOSHIYUKI
分类号 H01L23/12;H01L23/50;(IPC1-7):H01L23/50 主分类号 H01L23/12
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