| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent semiconductor chips from being mounted wrongly on a defective substrate by identifying defective products, using a position recognition mark used, when semiconductor chips are mounted. SOLUTION: A plurality of device regions 8a, arranged in a matrix are formed on a substrate used for one-batch mold, to obtain a large number of chips. These device regions 8a are resin-molded to be covered in batch. L-shaped position recognition marks 10 are formed in the vicinity of two corners opposed to each other of an individual device region 8a. This position recognition mark 10 is formed, by performing gold plating or the like on the surface of the substrate for obtaining a large number of chips are used as a recognition mark for positioning, when semiconductor chips are mounted. If a defect is located in a device region 8a, the position recognition mark 10 is eliminated beforehand so as not to be recognized, with mounting of semiconductor chips on the region 8a being preventable. The position recognition mark 10 is eliminated by applying laser beams to grind the whole surface of the position recognition mark 10.</p> |
