| 摘要 |
<p>PROBLEM TO BE SOLVED: To prevent bonding strength from lowering, after use over a long term by performing void-free soldering at the time of mounting a surface mounting semiconductor on a printed wiring board. SOLUTION: The lead 2 of a semiconductor device 7 is provided with fine holes 3, and solder 4 is thermally fused in a reflow furnace, thus bonding the lead 2 of the semiconductor device 7 to the copper land 6 of a printed wiring board 5. Since bubbles generated in the solder are discharged through the fine holes 3, void-free soldering is ensured.</p> |
