发明名称 HIGH-RESOLUTION PHOTORESIST STRUCTURING OF MULTI-LAYER STRUCTURES DEPOSITED ONTO SUBSTRATES
摘要 <p>For fabricating a multi-layer structure of m 2 layers deposited on a substrate, a radiation irradiated by structure elements themselves is used for the lithographic exposure of a covering layer thus to achieve spatial self-alignment between the different layers. In a first step, a first layer is deposited onto the substrate. In a next step, the first layer is structured into structure elements. In a further step, a second layer of a material, which is sensitive to a physical and/or chemical interaction appropriate for an image transfer from the structure elements into the second layer, is deposited onto the substrate. The second layer is exposed with a pre-mentioned interaction originated or modulated by the structure elements. Finally, the exposed or non-exposed material of the second layer is removed from the substrate thus revealing the second layer structured in accordance with said image transfer.</p>
申请公布号 WO2002067054(A2) 申请公布日期 2002.08.29
申请号 EP2002001140 申请日期 2002.02.05
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