发明名称 HEMT AND COMMUNICATION SYSTEM USING THE SAME
摘要 A HEMT has an InAlAs layer (202), an InGaAs layer (203), a multiple -doped InAlAs layer (204) composed of n-type doped layers (204a) and undoped layers (204b) which are alternately stacked, an InP layer (205), a Schottky gate electrode (210), a source electrode (209a), and a drain electrode (209b) on an InP substrate (201). When a current flows in a region (channel region) of the InGaAs layer (203) adjacent the interface between the InGaAs layer (203) and the multiple -doped InAlAs layer (204), a breakdown voltage in the OFF state can be increased, while resistance to the movement of carriers passing through the multiple -doped InAlAs layer (204) as a carrier supplying layer is reduced.
申请公布号 WO0243156(A3) 申请公布日期 2002.08.29
申请号 WO2001JP10192 申请日期 2001.11.21
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.;YOKOGAWA, TOSHIYA;SUZUKI, ASAMIRA;DEGUCHI, MASAHIRO;YOSHII, SHIGEO;FURUYA, HIROYUKI 发明人 YOKOGAWA, TOSHIYA;SUZUKI, ASAMIRA;DEGUCHI, MASAHIRO;YOSHII, SHIGEO;FURUYA, HIROYUKI
分类号 H01L21/8252;H01L27/06;H01L29/20;H01L29/778;H03F3/60 主分类号 H01L21/8252
代理机构 代理人
主权项
地址