发明名称 |
DIAGNOSTING RELIABILITY OF VIAS BY E-BEAM PROBING |
摘要 |
Electronic devices, such as IC devices, are tested by determining a failure net within the electronic device that is causing a device failure. After identifying the failure net, the failure net is locally stressed. The stress is applied so that only the net being tested is subjected to the stress, and the remaining nets and components of the device are not stressed. A change in a signal produced by the failure net is observed while the failure bet is being subjected to the stress. The testing in this manner assists in identifying the failure net as a failure source of the device. |
申请公布号 |
WO0198788(A3) |
申请公布日期 |
2002.08.29 |
申请号 |
WO2001US19943 |
申请日期 |
2001.06.21 |
申请人 |
QUALCOMM INCORPORATED |
发明人 |
XIA, WILLIAM;VILLAFANA, MARTIN;TAPPAN, JONATHAN;WATSON, TIM;CAMPBELL, MICHAEL |
分类号 |
G01N23/225;G01R31/30;G01R31/307;G01R31/317;G01R31/319;H01J37/28;H01L21/66 |
主分类号 |
G01N23/225 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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