| 摘要 |
A multi-chip module made by using a direct attach method for manufacturing a multi-chip module by manufacturing a plurality of chips using a direct attach method and encapsulating the multi-chip models. The direct-attach method of manufacturing includes providing a special-design printed circuit board, manufacturing a lead frame with special design features including a central cavity for accommodating the specially designed printed circuit board and chips, assembling the lead frame and the printed circuit board using a conductive epoxy and curing the lead frame and printed circuit board assembly. The special-design printed circuit board includes a plurality of locating holes used for aligning the lead frame with the printed circuit board, a plurality of peripheral holes adapted to receive a corresponding lead frame finger, non-pointed corners, a silver or gold final plurality and a dry film. |
