| 发明名称 |
SEMICONDUCTOR DEVICE AND ITS COOLING SURFACE FORMING METHOD |
| 摘要 |
Countless columnar or planar protrusions are made on the surface of a semiconductor device and an electrically insulating thin film of SiO2, or the like, is formed on the entire surface including these protrusions by sputtering, ion plating or CVD, thus improving heat transfer characteristics of the surface. |
| 申请公布号 |
WO02067323(A1) |
申请公布日期 |
2002.08.29 |
| 申请号 |
WO2002JP01607 |
申请日期 |
2002.02.22 |
| 申请人 |
JAPAN SCIENCE AND TECHNOLOGY CORPORATION;HONDA, HIROSHI;TAKAMATSU, HIROSHI |
发明人 |
HONDA, HIROSHI;TAKAMATSU, HIROSHI |
| 分类号 |
H01L23/367;(IPC1-7):H01L23/34 |
主分类号 |
H01L23/367 |
| 代理机构 |
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代理人 |
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