发明名称 |
Methods for fabricating flexible circuit structures |
摘要 |
Improved methods and articles used to fabricate flexible circuit structures are disclosed. The methods include depositing a release layer or a dielectric film on a substrate, and then forming a conductive laminate on the release layer or the dielectric film. The conductive laminate may be easily separated by the substrate to eventually form a flexible circuit structure.
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申请公布号 |
US2002117256(A1) |
申请公布日期 |
2002.08.29 |
申请号 |
US20010872629 |
申请日期 |
2001.05.31 |
申请人 |
MCCORMACK MARK THOMAS;ROMAN JAMES;ZHANG LEI;BEILIN SOLOMON I. |
发明人 |
MCCORMACK MARK THOMAS;ROMAN JAMES;ZHANG LEI;BEILIN SOLOMON I. |
分类号 |
H05K3/00;H01B13/00;H05K3/02;H05K3/20;(IPC1-7):C23F1/00 |
主分类号 |
H05K3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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