APPARATUS AND METHOD FOR SURFACE POLISHING

摘要

A brand new surface polishing apparatus replacing chemical mechanical polishing (CMP) employed in precise polishing of a semiconductor device requiring strain-free planarization machining. The surface polishing apparatus comprises means for supporting a work, a polishing tool of elastic material moving relatively to a plane of the work being polished, and means for supplying polishing slurry between the plane and the polishing tool. The plane is subjected to noncontact polishing utilizing a trace destruction phenomenon occurring when abrasive grains in the polishing slurry, taken into a micro gap formed between the plane and the polishing tool by means of the polishing tool during polishing operation, collide against the plane at a high speed and an accurate angle.