发明名称 |
Conductive polishing article for electrochemical mechanical polishing |
摘要 |
An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate and a mounting surface. A plurality of perforations may be formed in the polishing article for flow of material therethrough. In another aspect, a polishing article for polishing a substrate includes a body having a polishing surface and a conductive element disposed therein. The conductive element may have a contact surface that extends beyond a plane defined by the polishing surface. The polishing surface may have one or more pockets formed therein. The conductive element may be disposed in each of the polishing pockets.
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申请公布号 |
US2002119286(A1) |
申请公布日期 |
2002.08.29 |
申请号 |
US20010033732 |
申请日期 |
2001.12.27 |
申请人 |
CHEN LIANG-YUH;WANG YUCHUN;WANG YAN;DUBOUST ALAIN;CARL DANIEL A.;WADENSWEILER RALPH;BIRANG MANOOCHER;BUTTERFIELD PAUL D.;MAVLIEV RASHID;TSAI STAN D. |
发明人 |
CHEN LIANG-YUH;WANG YUCHUN;WANG YAN;DUBOUST ALAIN;CARL DANIEL A.;WADENSWEILER RALPH;BIRANG MANOOCHER;BUTTERFIELD PAUL D.;MAVLIEV RASHID;TSAI STAN D. |
分类号 |
B23H5/08;B24B37/04;B24B53/007;B24B57/02;B24D13/14;H01L21/321;(IPC1-7):B32B3/00 |
主分类号 |
B23H5/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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