发明名称 Method of depositing low dielectric constant silicon carbide layers
摘要 A method of forming a silicon carbide layer for use in integrated circuits is provided. The silicon carbide layer is formed by reacting a gas mixture comprising a silicon source, a carbon source, and a nitrogen source in the presence of an electric field. The as-deposited silicon carbide layer incorporates nitrogen therein from the nitrogen source.
申请公布号 US2002119250(A1) 申请公布日期 2002.08.29
申请号 US20010793818 申请日期 2001.02.23
申请人 APPLIED MATERIALS, INC. 发明人 CAMPANA FRANCIMAR;NEMANI SRINIVAS;CHAPIN MICHAEL;VENKATARAMAN SHANKAR
分类号 C23C16/36;H01L21/027;H01L21/311;H01L21/314;H01L21/768;(IPC1-7):C23C16/00;C23C16/24;C23C16/26;C23C16/32 主分类号 C23C16/36
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