BUMPLESS SEMICONDUCTOR DEVICE

摘要

A bump-less semiconductor device comprising conductive particles (4) metal-bonded to the electrode pad (2) of a semiconductor device, being capable of connecting an IC chip (1) to a circuit board (5) by a flip-chip method with high reliability and at low costs while restricting shorts, reducing connection costs, restricting stress concentration on a connection portion, and reducing damages to the IC chip (1) and the circuit board (5), and being provided with a passivation film (3) around the pad. Composite particles having a metal plating layer formed on each of the surfaces of resin particles are used as conductive particles (4). The bump-less semiconductor device is fabricated (a) by electrostatically attracting conductive particles (4) onto one surface of a flat plate, and (b) by stacking the conductive particles-attracted surface of the flat plate on the electrode pad surface of the semiconductor device for ultrasonic press-bonding to thereby metal-bond conductive particles (4) to the electrode pad (2) and transfer-bond them from the flat plate onto the electrode pad (2) and trasfer-bond them from the flat plate onto the electrode pad (2).