发明名称 |
Stitched plane structure and process for package power delivery and dual referenced stripline I/O performance |
摘要 |
Conductive planes in a power delivery region of a microelectronic package substrate are stitched to correlated conductive planes in a signal region of the substrate. The conductive planes occupy varying horizontal levels of the substrate and are stitched together at a junction between the power delivery region and the signal region of the substrate using alternating tabs connected with vias. |
申请公布号 |
US2002117744(A1) |
申请公布日期 |
2002.08.29 |
申请号 |
US20000751542 |
申请日期 |
2000.12.29 |
申请人 |
WOOD DUSTIN;ONG SENG HOOI;BURTON EDWARD A. |
发明人 |
WOOD DUSTIN;ONG SENG HOOI;BURTON EDWARD A. |
分类号 |
H01L23/498;H01L23/50;(IPC1-7):H01L21/44 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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