| 摘要 |
A system and method for classifying contaminating particles on a wafer surface. The present invention collects first and second sets of data with the locations and sizes of contaminating particles upon a surface of a semiconductor wafer at a first time and a second time, respectively. An intervening process may alter the contaminating particle landscape of the wafer surface, altering the number and location of contaminating particles between the first and second times. To understand this change, the invention then compares the locations and sizes of the contaminating particles and further classifies the particles as belonging to one of three categories: fixed, removed and added. The results of this process are then compiled into various output forms. These data comparisons and classifications allow users to understand the source and impact of contaminating particles, so that the intervening may be altered, if required, to reduce the impact of contaminating particles.
|
