APPARATUS FOR FORMING LEAD LINE OF SEMICONDUCTOR DEVICE

摘要

PURPOSE: An apparatus for forming a lead line of a semiconductor device is provided to prevent generation of a crack by pushing a junction part in a device bending process and perform easily a forming work by executing automatically a cutting process and a bending process. CONSTITUTION: A lead line forming apparatus is formed with a lead line extension part and a lead line complex processing part(200). The lead line complex processing part(200) is formed at a rear end portion of the lead line extension part. The lead line complex processing part(200) is used for pressing, cutting, and bending a peripheral lead line of a body of a device(10) passing the lead line extension part. A gear(400) is formed on an outer circumference of a drive shaft. The gear(400) of the drive shaft is connected with a drive motor(500) by a chain. The second cam(404) is installed at a rear end portion of the drive shaft. A support plate(202) including a guide hole(210) is formed at a lower end portion of the second cam(404). A floating rod(206) is installed in the guide hole(210). A lead line support portion(212) is combined with a lower end portion of the floating rod(206). A spring(214) is installed on an outer circumference of the floating rod(206). A support plate(232) is formed at a lower portion of the lead line support part(212). A guide groove(216) is formed at a side of the lead line support portion(212). A plurality of bending parts(218) is combined with both sides of the lead line support portion(212). A plurality of blades(220) is adhered to a side of the bending portion(218). A buffer spring(230) is inserted between the support plate(202) and a support bar.