发明名称 WAFER STAGE AND BAKE APPARATUS USING THE SAME
摘要 PURPOSE: A wafer stage and a bake apparatus using the same are provided to load a wafer on a center portion of a stage by controlling a position of the wafer. CONSTITUTION: A bake apparatus has a wafer stage(120). A process chamber(110) and a wafer are loaded on the wafer stage(120). The wafer stage(120) has a heating plate(122), a lift pin, and 4 wafer guides(126). The wafer is loaded on the heating plate(122). The lift pin is used for loading the wafer from a robot on the heating plate(122). The wafer guides(126) are used for guiding the wafer to a correct position of the heating plate(122). The wafer guides(126) are installed at an edge portion of the heating plate(122). The wafer guide(126) is formed by a band wire(126a) having an incline plane of 45 degrees. Both end portions of the band wire(126a) is combined with grooves of the heating plate(122).
申请公布号 KR20020068603(A) 申请公布日期 2002.08.28
申请号 KR20010008698 申请日期 2001.02.21
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 CHOI, JIN U
分类号 H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/68
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