A method and apparatus for implanting semiconductor wafer substrates,申请号GB20020017075-传众专利搜索

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发明名称	A method and apparatus for implanting semiconductor wafer substrates
摘要
申请公布号	GB0217075(D0)	申请公布日期	2002.08.28
申请号	GB20020017075	申请日期	2001.02.05
申请人	APPLIED MATERIALS INC	发明人
分类号	H01J37/317;H01L21/687	主分类号	H01J37/317
代理机构		代理人
主权项
地址

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