| 摘要 |
PROBLEM TO BE SOLVED: To provide an episulfide resin which can be used in the fields of semiponductor encapsulating materials, laminating materials, resist inks, adhesives, casting materials coating materials and electrical insulating materials, etc. SOLUTION: The process for the preparation of an episulfide resin comprises the reaction of a raw material epoxy resin which has a content of 90 wt.% or more of a diglycidyl ether represented by general formula (1) (wherein, R1 and R2 are each, the same or different, a hydrogen atom, a 1-6C alkyl or phenyl group; R3, R4, R5 and R6 are each, the same or different, a hydrogen atom, a halogen atom or a 1-4C alkyl group) with a sulfidizing agent in water or an organic solvent.
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