| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition excellent in the relaxation effect of strain generated in a semiconductor element and a wiring board and a connecting electrode, capable of easily forming a sealing resin layer in the gap between the semiconductor element and the wiring board, and requiring no flux cleaning process, and a semiconductor device therewith and a method of its manufacture. SOLUTION: This thermosetting resin composition contains an epoxy resin, a phenol resin curing agent, and a compound represented by formula (1): R1-(COO-CH(CH3)-O-R2)n (wherein, n is a positive integer; R1 is at least a monovalent organic group; R2 is a monovalent organic group, and they may be the same as or different from each other), or a compound represented by formula (2): -(OCO-R3-COO-CH(CH3)-O-R4-O-CH(CH3))n (wherein, n is a positive integer; R3 and R4 are each a divalent organic group, and they may be the same as or different from each other). |
