| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a sealing epoxy resin composition giving one side sealing type packages which are scarcely warped and have excellent reflow resistance, and to provide a one side sealing type semiconductor device sealed with the sealing epoxy resin composition, scarcely warped and having excellent reflow resistance. SOLUTION: This sealing epoxy resin composition comprising an epoxy resin, a curing agent, an inorganic filler, and a curing accelerator is characterized by containing an epoxy resin represented by the general formula (1) (R1, R2, R3 and R4 are each H or a 1 to 4C alkyl) as the epoxy resin and containing a phenolic curing agent represented by the general formula (2) (R5 is H or 1-4C alkyl; n is an integer of 0-5) as a curing agent. The one side sealing type semiconductor device in which a semiconductor element loaded on a base substrate is sealed only on the semiconductor element-loading side of the base substrate with the sealing epoxy resin composition is provided.</p> |
