LAMINATE AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a laminate useful for a flexible printed circuit board having a polyimide insulating resin layer, which can be subjected to etching processing by an alkali aqueous solution, and a metal foil. SOLUTION: In the laminate wherein an insulating resin layer comprising more than one polyimide resin layers are provided on the metal foil, the insulating resin layer has at least one low thermal expansion polyimide resin layer (A) with the coefficient of linear thermal expansion of 30×10-6/ deg.C or less and at least one polyimide resin layer (B) with a glass transition temperature of 300 deg.C or lower. The layer coming into contact with the metal foil is a polyimide resin layer (B) with a glass transition temperature of 300 deg.C or lower. The adhesion strength of the polyimide layer (B) coming into contact with the metal foil and the metal foil is 0.5 kN/m or more and the average value of the etching speed by a 50 wt.% potassium hydroxide aqueous solution at 80 deg.C of the insulating resin layer is 0.5μm/min or less.