PLATING APPARATUS AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To uniformly deposit an electrically conductive film on a semiconductor substrate by preventing the concentration of the electric current on the outer circumferential part of the semiconductor substrate. SOLUTION: A head 2 holds a semiconductor substrate 3 in a plating tank 1 filled with a plating solution 10. A cathode electrode 22 applies a minus potential to the semiconductor substrate 3. A plating solution feed port 6 feeds a plating solution into the plating tank 1. An anode electrode 5 is confronted with the semiconductor substrate 3 and a plus potential is applied thereto. A magnetic circuit 41 forms a magnetic field within the plating tank 1. The magnetic circuit 41 has electromagnet coils arranged so as to surround the central axis of the semiconductor substrate 3, and a power source feeding the electric current to the electromagnet coils.