| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting epoxy resin composition satisfying heat resistance, electrical insulating characteristic, and at the same time adhesion strength of a conductive layer on a built-up multilayer printed wiring board, and also excellent in storage stability, its molding, and a build-up multilayer printed wiring board made therefrom and capable of complying to high density. SOLUTION: This thermosetting epoxy resin composition contains (A) an epoxy resin having at least two epoxy groups in a molecule, (B) a curing agent having a phenolic hydroxyl group, and (C) an imidazole compound having a hydroxyl group as a curing accelerator. |
