发明名称 RESIN COMPOSITION, SOLDER RESIST RESIN COMPOSITION, AND THEIR CURED ITEM
摘要 PROBLEM TO BE SOLVED: To provide a resin composition which is prepared by using a novel oligomer having a high performance/a high function, especially one having stiffness, heat resistance, and flexibility, is excellent in developability, photosensitivity, and surface curability, and gives a cured item excellent e.g. in resistances to solvents, acids, and heat; and a cure item thereof. SOLUTION: This resin composition contains an oligomer (A) and a cross- linker (B). The oligomer (A) is prepared by reacting an epoxy compound (a) having at least two epoxy groups and exhibiting liquid crystalline properties with a monocarboxylic acid (b) having at least one double bond and reacting the resultant epoxy carboxylate compound (c) with a polybasic acid anhydride (d) having two acid anhydride groups and, optionally, a polyol compound (e).
申请公布号 JP2002241447(A) 申请公布日期 2002.08.28
申请号 JP20010042984 申请日期 2001.02.20
申请人 NIPPON KAYAKU CO LTD 发明人 KOYANAGI TAKAO;OZAKI TORU;YOKOSHIMA MINORU
分类号 C08F2/48;C08F290/06;C08G59/17;H05K3/28;(IPC1-7):C08F290/06 主分类号 C08F2/48
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