| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin molding material comprising an inorganic substrate and a silica gel, readily filling even a complicated shape and having excellent moldability. SOLUTION: This epoxy resin molding material is characterized by comprising 15-50 wt.% of an epoxy resin (including a curing agent), 10-20 wt.% of the silica gel and 35-65 wt.% of the inorganic substrate other than the silica gel based on the whole molding material as essential components.
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