发明名称 Semiconductor substrate and process for producing the same
摘要 <p>A process for producing a semiconductor substrate comprises the steps of forming a porous layer in a first substrate comprising monocrystalline silicon; forming a protective film on a side wall of the pores of the porous layer; forming a nonporous monocrystalline silicon layer on the porous layer; bonding the surface of the nonporous monocrystalline silicon layer onto a second substrate with interposition of an insulating layer; and etching off selectively the porous layer by use of a chemical etching solution.</p>
申请公布号 EP0553859(B1) 申请公布日期 2002.08.28
申请号 EP19930101420 申请日期 1993.01.29
申请人 CANON KABUSHIKI KAISHA 发明人 SATO, NOBUHIKO;YONEHARA, TAKAO
分类号 H01L21/02;H01L21/20;H01L21/306;H01L21/762;H01L27/12;(IPC1-7):H01L21/76;H01L21/316 主分类号 H01L21/02
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