Use of hydrocarbon addition for the elimination of micromasking during etching of organic low-k dielectrics,申请号AU20020247089-传众专利搜索

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发明名称	Use of hydrocarbon addition for the elimination of micromasking during etching of organic low-k dielectrics
摘要
申请公布号	AU2002247089(A1)	申请公布日期	2002.08.28
申请号	AU20020247089	申请日期	2002.02.07
申请人	LAM RESEARCH CORPORATION	发明人	CHOK W. HO
分类号	H01L21/00;H01L21/306;H01L21/311;H01L29/06;(IPC1-7):H01L21/306	主分类号	H01L21/00
代理机构		代理人
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