发明名称 Power MOSFET and method for fabricating the same
摘要 The semiconductor device of the present invention includes: a semiconductor layer of a first conductivity type; source and drain regions of a second conductivity type, which are formed within the semiconductor layer; a channel region provided between the source and drain regions; and a gate electrode formed over the channel region. The device further includes: a buried region of the first conductivity type, at least part of the buried region being included in the drain region; and a heavily doped region of the second conductivity type. The heavily doped region is provided at least between a surface of the semiconductor layer and the buried region. The concentration of a dopant of the second conductivity type in the heavily doped region is higher than that of the dopant of the second conductivity type in the drain region. <IMAGE>
申请公布号 EP0967660(A3) 申请公布日期 2002.08.28
申请号 EP19990111361 申请日期 1999.06.10
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 SOGO, SEIJI;UENO, YUJI;YAMAGUCHI, SEIKI;MORI, YOSHIHIRO;HACHIYA, YOSHIAKI;TAKAHASHI, SATORU;YAMANISHI, YUJI;HIRANO, RYUMA
分类号 H01L21/336;H01L29/06;H01L29/08;H01L29/78 主分类号 H01L21/336
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