发明名称 RESIN COMPOSITION, SOLDER RESIST RESIN COMPOSITION AND CURED PRODUCT THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a resin composition, which incorporates a new oligomer having a high performance and a high functionality, particularly an oligomer that has a high rigidity and a heat resistance as well as a flexibility, which is hence excellent in developability, photosensitivity and surface hardening properties, and whose cured product is excellent in solvent resistance, acid resistance, heat resistance and the like, and provide a cured product thereof. SOLUTION: There is provided a resin composition comprising an oligomer (A) and a crosslinking agent (B), the oligomer (A) being obtained by reacting a polyimide precursor (a) having a terminal anhydride group or a reaction product of (a) and a polyol compound (b) with an epoxycarboxylate compound (c) obtained by reacting an epoxy compound (c-1), which has two epoxy groups in the molecule and exhibits a liquid crystallinity, with a monocarboxylic acid (c-2) having one or more unsaturated double bonds in the molecule.
申请公布号 JP2002241468(A) 申请公布日期 2002.08.28
申请号 JP20010044476 申请日期 2001.02.21
申请人 NIPPON KAYAKU CO LTD 发明人 KOYANAGI TAKAO;OZAKI TORU;YOKOSHIMA MINORU
分类号 C08F2/44;C08F2/46;C08F299/02;C08G59/20;C08G73/10;H05K3/28;H05K3/46;(IPC1-7):C08G59/20 主分类号 C08F2/44
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