| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting device for a wiring board using a flexible thin film favorably applied to small-sized multiple function high integration. SOLUTION: The mounting device for wiring board using flexible thin film comprises a semiconductor substrate having high rigidity whereon an electric circuit is built, wiring board formed in a single piece with the substrate and having flexible thin film protruding from the periphery of the substrate, and a body having a groove greater than the periphery of the substrate and smaller than the periphery of the flexible thin film, wherein the body is furnished with a first electrical contact part while a second electrical contact part is provided on the flexible thin film portion of the wiring board confronting the first electrical contact part, and the two contact parts are contacted with each other by the pressure generated by bending of the flexible thin film portion so that an electric continuity is established.
|
