| 摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which has a flux activity that permits mounting of a flip chip by coating in advance a wiring circuit substrate in the manufacture a semiconductor device that needs the formation of a metallic bond such as solder bump, and a method of manufacturing a semiconductor device in which the composition is employed. SOLUTION: There is provided a thermosetting resin composition which comprises an epoxy resin and an acid anhydride curing-agent and is liquid at 25 deg.C, and which comprises a compound represented by formula (1): R1-(COO- CH(CH3)-O-R2)n (wherein, n is a positive integer; R1 is a monovalent or higher organic group; R2 is a monovalent organic group; and R1 and R2 may be the same or different) or represented by formula (2): -(OCO-R3-COO-CH(CH3)-OR4-O- CH(CH3))n (wherein, n is a positive integer; and R3 and R4 are each a divalent organic group and may be the same or different). |
