发明名称 Process of manufacturing a DRAM cell capacitor having increased trench capacitance
摘要 A trench capacitor having an increased surface area. In one embodiment, the trench capacitor is a dual trench capacitor having a first trench and a second trench wherein inner walls of the trenches electrically connect. The invention also includes a single trench capacitor wherein the trench is curved around an axis substantially perpendicular to a substrate surface.
申请公布号 US6440813(B2) 申请公布日期 2002.08.27
申请号 US20010767634 申请日期 2001.01.23
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 COLLINS CHRISTOPHER N.;JONES HARRIS C.;NORUM JAMES P.;SCHMITZ STEFAN
分类号 H01L21/334;H01L21/8242;(IPC1-7):H01L21/20 主分类号 H01L21/334
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