| 摘要 |
A manufacturing method of circuit modules comprising steps of melting a solder on a land by an energy of irradiating laser beam, and pressing an external electrode of an electronic component to a melted solder before the melted solder hardens. This method is capable of connecting the electrode of the component to the land of the substrate using the solder sufficiently heated and melted. A manufacturing apparatus of circuit modules comprises an adsorbing nozzle which adsorbs an electronic component and mounts it on a substrate, an optical system which projects laser beams to a solder preliminarily applied to an electrode of a substrates, and a control device which controls a component mounting and a laser beam irradiation so that the electrode of the electronic component is pressed to the solder melted by an energy of a irradiating laser beam before the melted solder hardens. This apparatus is capable of connecting the component with the above laser beam while controlling the component mounting and the laser beam irradiation.
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