发明名称 Dual buffer chamber cluster tool for semiconductor wafer processing
摘要 Apparatus for multi-chambered semiconductor wafer processing comprising a polygonal structure having at least two semiconductor process chambers disposed on one side. An area between the process chambers provides a maintenance access to the semiconductor processing equipment. Additionally, the apparatus may be clustered or daisy-chained together to enable a wafer to access additional processing chambers without leaving the controlled environment of the semiconductor wafer processing equipment.
申请公布号 US6440261(B1) 申请公布日期 2002.08.27
申请号 US19990318233 申请日期 1999.05.25
申请人 APPLIED MATERIALS, INC. 发明人 TEPMAN AVI;OLGADO DONALD J. K.;D'AMBRA ALLEN L.
分类号 H01L21/302;H01L21/00;H01L21/205;H01L21/3065;H01L21/677;(IPC1-7):H01L21/00 主分类号 H01L21/302
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