发明名称 |
Dual buffer chamber cluster tool for semiconductor wafer processing |
摘要 |
Apparatus for multi-chambered semiconductor wafer processing comprising a polygonal structure having at least two semiconductor process chambers disposed on one side. An area between the process chambers provides a maintenance access to the semiconductor processing equipment. Additionally, the apparatus may be clustered or daisy-chained together to enable a wafer to access additional processing chambers without leaving the controlled environment of the semiconductor wafer processing equipment.
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申请公布号 |
US6440261(B1) |
申请公布日期 |
2002.08.27 |
申请号 |
US19990318233 |
申请日期 |
1999.05.25 |
申请人 |
APPLIED MATERIALS, INC. |
发明人 |
TEPMAN AVI;OLGADO DONALD J. K.;D'AMBRA ALLEN L. |
分类号 |
H01L21/302;H01L21/00;H01L21/205;H01L21/3065;H01L21/677;(IPC1-7):H01L21/00 |
主分类号 |
H01L21/302 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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