| 摘要 |
The present invention provides a polishing pad. The polishing pad includes a base pad, such as a felt pad, having an outer surface, and a water-repellant film located on the outer surface. The water-repellant film typically provides the base pad with a water absorbency factor of less than about five percent. In another embodiment, the polishing pad has an outer surface having an outer edge and first and second opposing surfaces joined by the outer edge. The polishing pad, in a preferred embodiment, has the water-repellant film located on the outer edge and one of the first and second opposing surfaces. Located on the water-repellant film on one of the first and second opposing surfaces, in another embodiment, is a pressure sensitive adhesive.
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