Method for fabricating a semiconductor component having a wiring which runs piecewise in the substrate, and also a semiconductor component which can be fabricated by this method

摘要

A method for fabricating a wiring which runs at least piecewise in a substrate. At least one conductive connection runs in the semiconductor substrate and at least one conductive connection runs on the semiconductor substrate being provided. The semiconductor component enables applications in which high security against external manipulations is important.