STRUCTURE OF BALL GRID ARRAY SEMICONDUCTOR PACKAGE HAVING HEATSINK AND FABRICATING METHOD THEREOF

摘要

PURPOSE: A structure of a ball grid array semiconductor package having a heatsink and a fabricating method thereof are provided to emit the heat of the semiconductor to a mother board through the heatsink by using the heatsink having the high thermal conductivity. CONSTITUTION: A plurality of electronic circuits are integrated on a semiconductor chip(31). The semiconductor chip(31) is adhered on a printed circuit board(32). An opening type passing slot(32a) is formed on the printed circuit board(32). A wire(33) is used for connecting electrically the semiconductor chip(31) with the printed circuit board(32). A resin sealant(34) is used for molding an upper surface of the printed circuit board(32) in order to protect the semiconductor chip(31) from the external environment. A plurality of solder balls(35) are formed on a bottom face of the printed circuit board(32). A heatsink(36) is used for emitting the heat of the semiconductor to the outside.