Metallic microstructure springs and method of making same

摘要

A spring suitable for use in interposers such as those used to electrically interconnect electronic devices such as integrated circuits and printed wiring boards. The spring includes a central portion, a peripheral portion and a plurality of bent legs extending between the central portion and the peripheral portion. The bent legs optionally comprise alternating layers of copper and nickel. At least ode protuberance is preferably formed upon either side of the generally planar spring so as to facilitate electrical contact with desired electrical contacts of the devices to be interconnected.