Electronic package with plurality of solder-applied areas providing heat transfer

摘要

An electronic package in which an electronic component (e.g., LSI chip module) includes a heat dissipating surface (e.g., metal layer) and is positioned on a printed wiring board such that the heat dissipating surface is located adjacent a heat transfer area on the board. The heat transfer area is in the form of a pattern of solder-applied areas from which the solder bonds to the heat dissipating layer to provide heat transfer from the component to the board. Through holes may also be used in the board to increase heat removal.