发明名称 Method of controlling a polishing machine
摘要 Recipes for the polishing machine, such as recipes for carrier head pressure, are generated from empirical data, and consequently can provide a more accurate prediction than techniques based upon theoretical models. A plurality of test substrates are polished with a plurality of parameter sets. A polishing profile is measured for each of the plurality of test substrates, and a polishing time is calculated for each polishing parameter set which minimizes the difference between a predicted substrate profile and a desired substrate profile.
申请公布号 US6439964(B1) 申请公布日期 2002.08.27
申请号 US20000608418 申请日期 2000.06.30
申请人 APPLIED MATERIALS, INC. 发明人 PRAHBU GOPALAKRISHNA B.;MEAR STEVEN T.
分类号 B24B1/00;B24B37/04;B24B49/16;H01L21/304;H01L21/306;(IPC1-7):B24B49/00;B24B51/00 主分类号 B24B1/00
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