发明名称 SOI device and method of fabrication
摘要 A SOI DRAM unit comprising a MOS transistor and an improved SOI substrate having a back-gate control. The SOI substrate includes a first insulating layer, a first semiconductor layer having a first conductivity type, a second insulating layer, and a second semiconductor layer having a first conductivity type formed on a substrate. The MOS transistor includes a gate formed on the second semiconductor layer and a source and drain region, having a second conductivity type, formed on either side of the gate in the second semiconductor layer, wherein the source and the drain electrically connects to a bit line and a capacitor, respectively. A first oxidation region is formed in the first semiconductor layer below the source region and a second oxidation region is formed in the first semiconductor layer below the drain region. Both the first oxidation and second oxidation regions are contiguous with the second insulating layer.
申请公布号 US6441436(B1) 申请公布日期 2002.08.27
申请号 US20000725094 申请日期 2000.11.29
申请人 UNITED MICROELECTRONICS CORP. 发明人 WU DE-YUAN;LIU CHIH-CHENG
分类号 H01L21/8242;H01L27/108;H01L27/12;(IPC1-7):H01L27/01 主分类号 H01L21/8242
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