发明名称 |
Inserted components for via connection of signal tracks to achieve continuous impedance matching in multi-layer substrate |
摘要 |
A technique for connecting signal tracks within a multi-layer substrate is disclosed. In one embodiment, the technique is realized by providing an opening in a substrate and fitting an inserted component into the opening. The inserted component comprises a dielectric block mounted to a lead frame. The lead frame is conductive such that a signal layer formed between the inserted component and the substrate connects signal tracks on multiple signal layers of the substrate.
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申请公布号 |
US6441319(B1) |
申请公布日期 |
2002.08.27 |
申请号 |
US20000749470 |
申请日期 |
2000.12.28 |
申请人 |
NORTEL NETWORKS LIMITED |
发明人 |
HANDFORTH MARTIN R.;KWONG HERMAN;GOULETTE RICHARD R.;MEIER ROLF G. |
分类号 |
H01P1/04;H05K1/00;H05K1/02;H05K3/40;(IPC1-7):H01R9/09 |
主分类号 |
H01P1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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