| 摘要 |
A translator for connecting package terminals of a semiconductor chip package to connection pads on a substrate is disclosed. The package terminals are arranged in an array on the semiconductor chip package and the connection pads are arranged in an array on the substrate. The package terminals have a first pitch and the connection pads have a second pitch. The translator has a sheet-like support element with central region and a peripheral region which is more rigid than the central region. First translator terminals are exposed at a first surface of the support element, in the central region. Second translator terminals are exposed at a second surface of the support element, in the peripheral region. The first translator terminals have the first pitch so as to correspond to the package terminals and the second translator terminals have the second pitch so as to correspond to the connection pads. The first and second pitch are different. Traces are provided on the support element and are adapted to connect the package terminals to the first translator terminals. |
