| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which will have few resin burrs generated at an exposed part from a mold resin in a semiconductor device, including a chip mounted with a lead frame, molded and encapsulated with the mold resin, while part of a lead frame is exposed from the mold resin and the exposed face of the lead frame is fitted to the mold die in the mold- resin molding step. SOLUTION: A step part 5 is formed at the circumferential part of the exposed face, so that the exposed part is made to project thereby, and the mold resin 4 is polymerized at the step part 5 in the semiconductor device. |
