| 摘要 |
PROBLEM TO BE SOLVED: To simplify a structure, to enhance reliability, and to simplify a manufacturing process. SOLUTION: An IC module has a base board 111 composed of a sealing resin, a contact-noncontact common use type IC chip 112 embedded in an upper surface of the base board 111, a noncontact communication antenna 115A formed on the upper surface of the base board 111, an insulating layer 116 for covering at least the contact-noncontact common use type IC chip 112 and the noncontact communication antenna 115A with the upper surface of the base board 111, through-holes 116a and 116b arranged in the insulating layer 116, and communicating with connecting terminal parts of the contact-noncontact common use type IC chip 112 and the noncontact communication antenna 115A, a contact terminal 119A formed on the insulating layer 116, and a connecting part 119B for connecting the connecting terminal part of the contact-noncontact common use type IC chip 112 and connecting terminal parts of the noncontact communication antenna 115A and the contact terminal 119A. |
