| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition, whose cured product has excellent adhesion, pencil hardness, solvent resistance, acid resistance, heat resistance, gold plating resistance and the like. SOLUTION: An epoxy carboxylate compound (A) soluble in an alkali aqueous solution is a reaction product between an epoxy carboxylate to be obtained by reacting an epoxy compound (a) having two or more epoxy groups in the molecule, a monocarboxylic acid compound (b) having a heterocyclic structure in the molecule, and a monocarbyxlic acid compound (c) having an ethylenically unsaturated double bond in the molecule and a polybasic acid anhydride (d). The photosensitive resin composition uses this compound, and a cured product is obtained by curing the photosensitive composition. |
