发明名称 CIRCUIT BOARD DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a circuit board device which prevents a short circuit or the like, when solder protrudes on a land and whose productivity and reliability are enhanced, by forming a solder escape hole between the board and the land. SOLUTION: Lands 3 connected to a wiring pattern 2 are insulated on the board 1, and respective electrodes 5A of an electronic component 5 are connected to the lands 3 by the solder 10. Solder escape holes 7, making use of through-holes 6, are formed between the board 1 and the lands 3, and solder attraction lands 8 are installed on the side of a rear surface 1B of the board 1. When the electronic component 5 is mounted, excess solder 10A from among the molten solder 10 is made to escape to the holes 7, and the solder 10A is attracted to the lands 8. Thereby, the solder 10A is prevented from protruding from the lands 3, so as to come into contact with the lands 3 in the circumference, the yield of the circuit board device in its manufacture is increased, and the reliability of the circuit board device can be enhanced.
申请公布号 JP2002237673(A) 申请公布日期 2002.08.23
申请号 JP20010032102 申请日期 2001.02.08
申请人 MURATA MFG CO LTD 发明人 ITO YUICHI
分类号 H05K3/34;(IPC1-7):H05K3/34 主分类号 H05K3/34
代理机构 代理人
主权项
地址