发明名称 SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a substrate which facilitates highly reliable high-density mounting at low cost and respond to many kinds of semiconductor chips, and MCP can be customized. SOLUTION: In addition to normal stitches, auxiliary stitches 9, 10, 16, 17, 18, etc., are formed on an insulating layer 2 of a substrate 1 as excess stitches. The auxiliary stitches 9, 10 are connected with a jump wire 11. A pad A on a first chip 3 is wire-bonded to a stitch 6 through a wire 5. A pad A on a second chip 4 is wire-bonded to a stitch 8 through a wire 7. Furthermore, the stitch 6 is connected to the auxiliary stitch 9 by wiring, and the stitch 8 is connected to the auxiliary stitch 10 by wiring.
申请公布号 JP2002237567(A) 申请公布日期 2002.08.23
申请号 JP20010033930 申请日期 2001.02.09
申请人 NEC CORP 发明人 MIYAGAWA YUICHI
分类号 H01L25/18;H01L21/60;H01L25/065;H01L25/07 主分类号 H01L25/18
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