| 摘要 |
PROBLEM TO BE SOLVED: To reduce the package size of a three-dimensional mounting structure and improve productivity. SOLUTION: In a three-dimensional mounting structure, of which lower level is a flip-chip mounting structure and upper level is a wire-bonding mounting structure, a primary fixed portion 7 of the flip-chip mounting structure, which constitutes the lower level, is provided within a region of a first semiconductor layer 1. Consequently, a second electrode pad 19 for wire-bonding, which constitutes the upper level, can be disposed in the vicinity of the first semiconductor layer 1 of the lower level, and thus the package size as a three- dimensional mounting structure can be made compact. |
